1 |
Layer Count |
1-14 |
2 |
PCB Thickness |
0.4mm-3.2mm |
3 |
Tolerance of Finished PCB Thickness (≥0.8mm) |
±10% |
4 |
Tolerance of Finished PCB Thickness (0.4mm≤T≤0.8mm) |
±3mil(±0.075mm) |
5 |
Max. Warpage |
0.75% |
6 |
Drill Bit |
0.2mm-6.5mm |
7 |
Outer/Inner Copper Thickness(max) |
3OZ/3OZ |
8 |
Min. Dielectric Thickness |
3mil |
9 |
Base Material |
CEM-3; FR-4; Aluminum Base; Halogen Free |
10 |
Aspect Ratio (Through Hole) |
≤8:1 |
11 |
Hole Tolerance |
PTH:±3mil NPTH:±2mil |
12 |
Hole Registration Tolerance |
±3mil |
13 |
Hole Wall Copper Thickness |
≥18um |
14 |
Min. Outer Design L/S |
1/1OZ 3.5mil/3.5mil,2/2OZ 5mil/5mil,3/3OZ 6mil/6mil |
15 |
Min. Inner Design L/S |
H/HOZ 3mil/3mil,1/1OZ 4mil/4mil,2/2OZ 5mil/5mil,3/3OZ 6mil/6mil |
16 |
Etch Tolerance |
≤±20% |
17 |
Impedance for Inner and Outer Layer |
>55Ω:±10%Ω≤55Ω:±5Ω |
18 |
Solder Mask Thickness |
≥10um |
19 |
Min. Solder Mask Bridge |
3mil |
20 |
Min. Legend Width |
4mil |
21 |
Rout Tolerance |
±4mil |
22 |
Min. Rout Radius (Internal) |
≥16mil |
23 |
Min. V-CUT Board Thickness |
0.4mm |